DRV7308: thermal interface material to make up for package height

Tool/software:

Hello experts,

I had a quick question regarding GaN IPM's thickness,

Since our DRV7308’s IC thickness (1mm) is so much thinner than the usual IGBT IPMs, customer needs to review their memotor’s rear cover, and is considering making changes to its mechanical shape.

Have you seen any other WW customers doing a similar thing, with thermal interface material (the clay-like thing you put on IPM to attach heatsink)?

Thank you in advance for your help and support.